Wafer减薄划片

  季丰电子采购业界领先的设备组建晶圆磨划车间Grinding & Scribing,为设计公司解决wafer减薄划片的工程类需求以及封装厂对wafer减薄划片的产能需求,月产能达4000片。

Wafer Grinder

DISCO Wafer Grinder
DISCO Wafer Grinder

Wafer Saw

ASM/DISCO Wafer Saw
ASM/DISCO Wafer Saw